| 摘要 |
A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed. A substrate conveyor is provided in the substrate plating apparatus for loading substrates into the substrate plating apparatus and discharging substrates out of the substrate plating apparatus, or for performing at least one of the loading or discharging operations, such that the substrates are loaded into the substrate plating apparatus one at a time, plated in the plating process section, washed in the washing process section, and subsequently discharged one at a time from the substrate plating apparatus.
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