发明名称 THERMAL ADHESIVE TAPE FOR ELECTRONIC PART CONVEYANCE
摘要 PROBLEM TO BE SOLVED: To provide a thermal adhesive tape for electronic part conveyance which is not tacky at normal temperature, prevents electronic parts from falling down or inclining at a high temperature, and is excellent in capability for aligning electronic parts. SOLUTION: This thermal adhesive tape fixes electronic parts with an adhesive layer formed on the surface of a paper substrate. The adhesive layer comprises a styrenic block copolymer, a styrene resin, and a reactive phenolic resin and may further contain an aluminum chelating agent.
申请公布号 JP2002363524(A) 申请公布日期 2002.12.18
申请号 JP20010175077 申请日期 2001.06.11
申请人 NITTO DENKO CORP 发明人 ARAKI KYOICHI;ICHIKAWA HIROKI;NAKANO ICHIRO
分类号 C09J7/02;C09J125/04;C09J153/00;C09J161/06;(IPC1-7):C09J153/00 主分类号 C09J7/02
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