CLEANER COMPOSITION

摘要

The present invention relates to a cleaner composition. Specifically, the present invention relates to a cleaner composition that can be used to remove metal oxides and metal abrasive particles arising during metal polishing, such as chemical mechanical planarization (CMP). The cleaner composition has an improved ability to complex with metal abrasive particles. In addition, the cleaner composition maintains its ability to reduce metal abrasive particles, achieving improved stability. Therefore, the cleaner composition can be used for cleaning the surface of a metal with an increased ability to prevent corrosion of the metal surface.

主权项

1. A cleaner composition comprising a compound represented by Formula 1: wherein X and Y are each independently an atom or functional group having an unshared pair of electrons, R1 and R2 are each independently a hydrogen atom, a hydroxyl group, a carboxyl group or a substituted or unsubstituted C1-C20 alkyl group, and m and n are each independently an integer from 1 to 5.