PHOTODIODE PACKAGE FOR OPTICAL PICKUP APPARATUS AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A photodiode package for optical pickup apparatus and a method for fabricating the same are provided to maximize performance of photoelectric conversion by installing a chip for locating a light receiving portion of a photodiode on a printed circuit board having a light receiving hole. CONSTITUTION: A photodiode chip(35) has a flip-chip type having a connection pad(37). The photodiode chip(35) is loaded on a printed circuit board(40) in order to direct the photodiode(32) to a bottom portion. The printed circuit board(40) can be connected with an optical pickup apparatus by using a metal pad or a ball-shaped connection portion(42). A light receiving hole(45) is formed on the printed circuit board(40). An optical signal is transmitted from a lower portion of the printed circuit board(40) to the photodiode(32) through the light receiving hole(45). A resin molding portion(47) is formed on an upper portion of the printed circuit board(40) in order to protect the photodiode chip(35).