发明名称 Test and burn-in socket clamping mechanism
摘要 A test and burn-in socket assembly designed to hold an integrated circuit module during testing or burn-in has a base that mounts a printed circuit connection board. The base has a central opening in which the integrated circuit module can be inserted. A pair of locking arms that will engage and clamp the integrated circuit module onto the printed circuit board are supported on a movable frame that is movable toward and away from the base. The arms are moved between clamping and release positions as the movable frame is moved. The movable frame is actuate by cams that are simultaneously moved by a handle or bail. The clamping arms are controlled so that they will move perpendicular to the integrated circuit when they are close to the board and move laterally to provide a space for installing and removing a board from its installed position. The board that has been tested to be removed and a new board to be inserted.
申请公布号 US6514097(B1) 申请公布日期 2003.02.04
申请号 US20010920372 申请日期 2001.08.01
申请人 MICRO CONTROL COMPANY 发明人 CONROY CHAD M.
分类号 G01R1/04;(IPC1-7):H01R13/62 主分类号 G01R1/04
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