| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup element, capable of preventing sticking of foreign materials to a light receiving part in a package type solid- state image pickup element, for which a solid-state image pickup element chip, having a light-receiving part is sealed inside a package, and the opening part of a package facing the light-receiving part is covered with a light-transmitting member. SOLUTION: The package type solid-state image pickup element is provided with at least the package having an internal space, the solid-state image pickup element chip, having the light-receiving part sealed inside the internal space and the light-transmitting member arranged at the opening part of the package facing the light-receiving part to turn the internal space into a tightly sealed space, and an adhesive material layer is formed on the inner wall surface of the package forming the internal space.
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