| 摘要 |
Disclosed is an improved electrodeposition bath having a reduced volatile organic content. The bath contains a resinous phase dispersed in an aqueous medium, the resinous phase including an active hydrogen-containing ionic electrodepositable resin and a curing agent therefor. The improved electrodeposition bath further includes a boron-containing compound in an amount sufficient to retard the growth of microorganisms in the bath. Also disclosed is a method of electrocoating a conductive substrate using the improved electrodeposition bath of the invention. Substrates which are coated using the method of the invention are also disclosed.
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