| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for an electronic component capable of improving heat radiation performance of an electronic component. SOLUTION: The cooling device is provided with a housing box 2 provided with an electronic component housing chamber C1 where an electronic component 6 is disposed, a cooling fluid path 14 formed inside the box 2 and allowing a cooling fluid to flow, an a bulkhead for partitioning the chamber C1 from the path 14. Consequently, heat of the component 6 may be transmitted to the cooling fluid of the path 14 through the bulkhead 13. The device is also provided with a heat transmitting member 20 contacting with at least the top surface of the component 6 and the bulkhead 13, and a thermal insulating material 15 provided inside the box 2 to suppress the transmission of the heat of an external portion A1 of the box to the member 20, the component 6 and the bulkhead 13.
|
