| 摘要 |
PROBLEM TO BE SOLVED: To provide the inspecting method of a semiconductor device, with which damage to a bonding pad is reduced. SOLUTION: A conductive member is disposed between the bonding pad of the semiconductor device, which is formed on a semiconductor wafer, and the probe of an inspection device (S1). Then, the semiconductor device is inspected (S2). The conductive member is removed from the bonding pad (S3). Thus, the damage to the bonding pad can be prevented since the probe is not directly pressed to the bonding pad.
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