发明名称 |
ELEKTROPLATTIERUNGSANLAGE, VERWENDUNG VON ELEKTRODE UND GEGENHALTER DAFÜR UND ELEKTROPLATTIERUNGSVERFAHREN |
摘要 |
The support surface (6B) of the support component has grooves (7) emerging in the plating bath. A support component (2) for feeding current to the electrodes in an electroplating process has a support surface (6B), sliding and in electrical contact with the electrodes (3). The support surface (6B) of the support component has grooves (7) emerging in the plating bath. Independent claims are also included for : the utilization of this support component, the electrode incorporating this component, the electroplating installation using the electrode and the associated electroplating process. |
申请公布号 |
AT233835(T) |
申请公布日期 |
2003.03.15 |
申请号 |
AT19980402805T |
申请日期 |
1998.11.13 |
申请人 |
SOLLAC |
发明人 |
GHEERAERT, PHILIPPE;VIENNE, JEAN-MARIE;VANDENBUSSCHE, BERNARD |
分类号 |
C25D17/10;C25D7/06;C25D17/00;(IPC1-7):C25D17/00 |
主分类号 |
C25D17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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