| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device, capable of decreasing a difference in temperature between the best device and the worst device to enable normal electric characteristic test, uniting a plurality of heat sinks into one body to be attached and detached to and from a burn-in device, and realizing the device configuration to reduce the remodeling cost and not to impair flexibility of the device. SOLUTION: This manufacturing method is applied to a burn-in sorting process for a semiconductor device such as a synchronous SRAM, and a plurality of burn-in boards 11 and a plurality of radiator units 12 are alternately and vertically arranged removably in the respective stages of the burn-in device. Each heat sink 31 of the radiator unit 12 is normally in the open state where a tandem fin 41 is separated from the semiconductor device 23, and put in the state where the tandem fin 41 comes into contact with the semiconductor device 23 with designated pressing force by moving a base 32 with the sliding mechanism. In such a contact state, electric characteristic test is carried out.
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