| 摘要 |
A semiconductor device of a surface-mounting type having a mount surface to be joined with a mounting substrate includes a lead frame (4), semiconductor chip (2), and a resin (12) covering said the semiconductor chip. A mounting surface of an electrode terminal extracted from the semiconductor chip via the lead frame and surfaces of electrodes (20A, 20B) formed in the semiconductor chip are exposed to the mount surface to be substantially flush with the plane of the mount surface.
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