发明名称 MANUFACTURING FIRE RETARDANT CIRCUIT BOARDS WITHOUT THE USE OF FIRE RETARDANT RESIN ADDITIVES
摘要 This invention relates to printed circuit boards having improved fire resistance and improved environmental stability. The invention provides halogen-free fire retardant printed circuit boards incorporating potentially flammable polymers. Flame resistant thermoplastic layers prevent combustion of thermosetting polymers, as well as adding strength to the laminate, resulting in a less brittle thin core than the prior art. The flame resistant circuit board is cost efficient, environmentally safe and has excellent properties, including a decreased probability of shorting, good dielectric breakdown voltage, a smooth surface and good electrical/thermal performance.
申请公布号 KR20030026360(A) 申请公布日期 2003.03.31
申请号 KR20037003213 申请日期 2003.03.04
申请人 发明人
分类号 H05K3/00;B32B15/08;H05K1/03 主分类号 H05K3/00
代理机构 代理人
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