发明名称 Electronic component with at least one semiconductor chip and method for its manufacture
摘要 The invention relates to an electronic component (2) with at least one semiconductor chip (4) and a flat chip carrier (6) assigned to the at least one semiconductor chip, electrical connections between contact areas (43) on an active chip surface (41) of the semiconductor chip and contact terminal areas (63) on an upper side (61) of the chip carrier being formed by means of strips (81) of material which can undergo microstructuring and are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component (2).
申请公布号 US2003071336(A1) 申请公布日期 2003.04.17
申请号 US20020247966 申请日期 2002.09.20
申请人 GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUMPFL CHRISTIAN;THUMBS JOSEF;WEIN STEFAN;WORNER HOLGER 发明人 GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUMPFL CHRISTIAN;THUMBS JOSEF;WEIN STEFAN;WORNER HOLGER
分类号 H01L21/60;H01L23/31;H01L23/49;(IPC1-7):H01L23/02 主分类号 H01L21/60
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