Wire laying plate assembly and a molding process for an insulation plate

摘要

A wire laying plate assembly includes a plurality of synthetic resin insulating plates (25-27). Bosses (46-48) project from at least one of the insulating plates (24-26). At least one other of the insulating plates (25-27) is formed with boss-escaping portions (55-57) for accommodating leading ends (49-51) of the bosses (46-48) formed on different insulating plates (24-26). The boss-escaping portions (55-57) gradually become deeper from their outer peripheries toward their centers. Busbars (28-31) are arranged between the insulating plates (24-27). The busbars (29-31) are formed with insertion holes (52-54). The busbars (29-31) are secured to the insulating plates (24-27) by inserting the bosses (46-48) through the insertion holes (52-54) and crimping them. In this way, a wire laying plate assembly (19) is assembled.