| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that since an electronic component mounting device in a conventional electronic apparatus mounts the component directly on a printed board which brings about a deflection due to a vibration amplitude, it is necessary to take measures to suppress the deformation of electronic component leads, and hence the board is increased in weight and in size due to the decrease in the mounting density of the component of the board caused by a restriction in the disposition of the component. SOLUTION: The electronic component mounting device comprises the electronic component 13 mounted on an electronic component substrate 22, and a support 23 having thermal conductivity for coupling between the board 11, the substrate 22 and the body of the component 13. The component 13 is mounted so as to be opposed to the board 11. The four corners of the substrate 22 are supported by absorbers 25, and fixed to the board 11.
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