发明名称 MANUFACTURING METHOD OF LAMINATED TYPE ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a low cost laminated type electronic parts whereby a transcribing strength can be improved for a ceramic green sheet of a conductive pattern made by a thin film forming method. SOLUTION: There are provided a process for forming a metal layer 9 on a mold-releasing layer 7 of a supporter 1, a process for forming a conductor pattern 13 by cutting the metal layer 9 by either a rotary blade, a laser machining or an electrical discharge machining, and a process for exfoliating the conductor pattern 13 off the mold-releasing layer 7 on the supporter 1 and laminating it on a ceramic green sheet 17 whereon the above conductor pattern 13 is formed.
申请公布号 JP2003133169(A) 申请公布日期 2003.05.09
申请号 JP20010330245 申请日期 2001.10.29
申请人 KYOCERA CORP 发明人 YAMAGUCHI KATSUYOSHI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
代理机构 代理人
主权项
地址