发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
A semiconductor device is disclosed which includes a semiconductor chip having a plurality of electrode pads on its upper surface; terminals such as copper posts formed on the upper surface of the semiconductor chip, and electrically connected to each of the electrode pads; a resin deposited on the upper surface of the semiconductor chip, encapsulating the terminals but exposing at least some of them to a predetermined height; and electroconductor members such as solder balls connected to the terminals. There is also disclosed a method of fabricating such a semiconductor device.
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申请公布号 |
US6573598(B2) |
申请公布日期 |
2003.06.03 |
申请号 |
US20000542291 |
申请日期 |
2000.04.04 |
申请人 |
OKI ELECTRIC INDUSTRY CO, LTD. |
发明人 |
OHUCHI SHINJI;KOBAYASHI HARUFUMI;SHIRAISHI YASUSHI |
分类号 |
H01L23/12;H01L21/56;H01L21/60;H01L21/768;H01L21/78;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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