| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treatment device and a drying method for a wafer in which the wafer can be dried in a short time. SOLUTION: Treatment parts 21-24 in the wafer treatment device are each provided with a spin chuck 31 to be spun around a perpendicular axial line while approximately horizontally holding a wafer W. Under the spin chuck 31, a rotating drive mechanism 35 is provided for applying a rotational drive force to a rotary shaft 34 of the spin chuck 31. Above the spin chuck 31, an optical film thickness system 51 is arranged for measuring the thickness of a thin film on the surface of the wafer W. The optical film thickness system 51 is connected to a flood lamp 53 and a beam splitter 55. When rotating and drying the wafer W, a control unit 60 determines that the wafer W is dried on the basis of an output from the beam splitter 55, controls the rotating drive mechanism 35, and stops the rotation of the wafer W. COPYRIGHT: (C)2003,JPO
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