发明名称 Molding die for forming disk substrate
摘要 A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4. The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3. In addition, a cavity 6 as a closed space is formed between a stamper 1b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2b of a moving side mirror 2. While the moving side mirror 2 is being press-contracted to the fixed side mirror 1, when a resin material is filled into the cavity 6, the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4, a plurality of openings 4a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.
申请公布号 US2003147990(A1) 申请公布日期 2003.08.07
申请号 US20020311853 申请日期 2002.12.20
申请人 MATSUURA OSAMU;MIURA KAZUHIRO;YOSHIMURA HIDEAKI;KISHI SHINSUKE 发明人 MATSUURA OSAMU;MIURA KAZUHIRO;YOSHIMURA HIDEAKI;KISHI SHINSUKE
分类号 B29C45/26;B29C45/34;(IPC1-7):B29D11/00;B29C45/00 主分类号 B29C45/26
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