SEMICONDUCTOR FABRICATION APPARATUS FOR SEMICONDUCTOR SUBSTRATE CLEANING PROCESS AND CLEANING PROCESS USING THE SAME

摘要

PURPOSE: A semiconductor fabrication apparatus for a semiconductor substrate cleaning process and a cleaning process using the same are provided to remove easily a hardened photoresist part by mixing a gasified cleaning solution with ozone. CONSTITUTION: A semiconductor fabrication apparatus for semiconductor substrate cleaning process includes a cleaning process chamber(110), a cleaning gas supply portion(120), an ozone supply portion(130), a steam supply portion(125), and a reaction gas exhaust portion(140). The cleaning process chamber has a substrate loading portion(111) for loading a semiconductor substrate(100) to perform a cleaning process in an airtight state. The cleaning gas supply portion supplies a cleaning solution of a gas state. The ozone supply portion supplies ozone to the cleaning process chamber. The steam supply portion supplies the steam to the cleaning process chamber. The process gas exhaust portion is connected to the process chamber in order to exhaust the cleaning gas.