发明名称 |
Manufacturing method for a piezoelectric component |
摘要 |
A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.
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申请公布号 |
US6604266(B1) |
申请公布日期 |
2003.08.12 |
申请号 |
US20000604262 |
申请日期 |
2000.06.27 |
申请人 |
TDK CORPORATION |
发明人 |
TAJIMA SEIICHI;KIRIYAMA TAKAHITO |
分类号 |
H03H3/04;H03H9/05;H03H9/17;H03H9/56;(IPC1-7):H04R17/00 |
主分类号 |
H03H3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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