METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor device, especially a step for making a via hole penetrating a semiconductor substrate. SOLUTION: Conduction reliability is enhanced between a surface side ground electrode and the rear surface by polishing the rear surface with mat finish after a via hole is made and inserting a barrier metal layer in order to prevent a surface side grounding metal and a rear surface bonding metal from being welded before the rear surface bonding metal is formed. COPYRIGHT: (C)2003,JPO