| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanically and electrically adaptable ground structure. SOLUTION: A metal member 10 for extended ground is inserted into an engaging hole 9 bored in an electric circuit substrate 6 and the entire part of a metal ground 7 of the electrical circuit substrate 6, a gradient portion 11 of the metal member 10 and a through-hole 12 formed in the gradient portion 11 are all soldered with solder 13. When such soldering is performed, mechanical coupling strength and an electrical characteristic can be improved by soldering the metal ground 7 and metal member 10 by the bridge structure of solder 13 by solidifying the solder 13 after it is inserted to the through-hole 12. COPYRIGHT: (C)2003,JPO
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