| 摘要 |
PROBLEM TO BE SOLVED: To enhance resistance against stress caused by heat or shock and to enhance reliability in mounting. SOLUTION: A lead electrode of a semiconductor device is constituted of a spring pin 6 of an elastic member, and with this arrangement, the spring pin 6 is joined to a mounting board 8 so that the semiconductor device is mounted to the mounting board. COPYRIGHT: (C)2003,JPO
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