| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film which can make the surface resin layer follow the projections and depressions on the surface of a substrate by simple operations, and to provide a printed wiring board using it. SOLUTION: The resin film for covering the surface of the wiring substrate 5 is made of a photo-curable thermoplastic resin. The printed wiring board 9 is composed of the wiring substrate 5 having a conductive layer 3 and a surface resin layer 1 which covers the surface of the wiring board 5. In this case, the surface resin layer 1 is formed by curing the resin film of the photo- curable and thermoplastic resin. COPYRIGHT: (C)2004,JPO
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