| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board in which a heat slag and a wiring board can be separated from each other and reused. SOLUTION: The printed wiring board comprises a wiring board 5 consisting of a resin insulating board 1 and a conductor pattern 3, and a heat slag 8 bonded to the wiring board 5 through a resin adhesive 7 wherein the resin insulating board 1 and the resin adhesive 7 are composed of a thermoplastic resin having a thermal deformation point of 240°C or above and the melting point of the resin adhesive 7 is lower than that of the resin insulating board 1. COPYRIGHT: (C)2004,JPO
|
