| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem about airtight sealing that is induced since a container for housing an electronic component is reduced in size and thickness. SOLUTION: The container for housing an electronic component is composed of an insulating substrate having a recess on its upper surface, and a cap 2 which is bonded to the upper surface of the substrate 1 by a glass sealant 6 and airtightly houses the electronic component 3 in a space formed between the cap 2 and the substrate 1. The cap 2 is composed of a plate-shaped board having a thickness of 0.3 mm and the outside dimension of the cap 2 is smaller than that of the substrate 1 by 0.1-0.3 mm. The outer periphery of the cap 2 is on the inside of that of the substrate 1 by 0.02-0.28 mm over the full periphery of the substrate 1. In addition, the glass sealant 6 is prepared by adding a cordierite-based compound having a mean particle diameter of 2.5-4μm and the maximum particle diameter of <35μm to a glass component containing phosphorus pentaoxide in an amount of 30-40 mass%, tin monoxide in an amount of 37-50 mass%, sodium oxide in an amount of 5-15 mass%, zinc oxide in an amount of 1-6 mass%, aluminum oxide in an amount of 1-4 mass%, and silicon oxide in an amount of 1-3 mass% in an amount of 16-45 mass% as a filler from the outside. COPYRIGHT: (C)2004,JPO
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