| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring auxiliary package which can transmit a signal at a high speed while making impedance match internal circuit wiring and is improved in wiring density. SOLUTION: The wiring of the wiring auxiliary package 111 is connected to a printed wiring board 112 through through-holes 120 of the printed wiring board 112 via pads of an IC 100. A microstrip line structure 114 or a microstrip line structure 115 is composed of grounding layers 113 of the wiring auxiliary package 111 electrically connected to grounding signals 116 of the IC 100 and either an upper or a lower wiring layer to obtain an impedance-matched wiring structure, so that the reflection of a signal occurring on a transmission line due to impedance mismatching can be prevented, and the signal can be transmitted at a high speed. COPYRIGHT: (C)2004,JPO
|
