| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable circuit board with a metal base plate and a mobile. SOLUTION: The circuit board with a metal base plate has a circuit made of aluminum having hardness of≤250 MPa on one surface of a ceramic substrate and a heat sink made of aluminum or an aluminum alloy having hardness of 300-460 MPa on the other surface of the substrate. In addition, a metal base plate made of copper, a copper alloy, aluminum, or an aluminum alloy is bonded to the heat sink through a soldering layer having a solder void rate of <10% and a maximum solder void diameter of <1 mm. The circuit, heat sink and/or metal base plate are coated with a plated-nickel film. The module uses the circuit board. COPYRIGHT: (C)2004,JPO
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