| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for selecting optimum chip components as a chip components supply device. SOLUTION: A chip capacitor CC, having a square pole shape is moved in an aligned state along a convey path 11a having a rectangular shape in reference cross-section, and when the chip capacitor CC passes a first inspection position IP1 set in the convey path 11a, one end surface diagonal dimension Da on one end side of the chip capacitor CC and the one end surface diagonal dimension Da on the other end side thereof are measured. When the chip capacitor CC passes a second inspection position IP2 set in the convey path 11a, the other end surface diagonal dimension Db on one end side of the chip capacitor CC and the other end surface diagonal dimension Db on the other end side thereof are measured. When at least one of the four end surface diagonal dimensions Da, Db measured deviates from dimensional ranges prescribed in advance, this is excluded from the convey path 11a as a nonconforming component. COPYRIGHT: (C)2004,JPO
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