SUBSTRATE-TREATING APPARATUS AND PLATING APPARATUS EQUIPPED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus which treats a rim of the substrate with a highly precise treatment width. SOLUTION: The substrate-treating apparatus 13 and 14 are each equipped with a substantially cylindrical washing cup 12 and a spin chuck 31 located therein which rotates a wafer W while holding it in a substantially horizontal position. Two etching members 2 and 3 are located at the sides of the wafer W held by the spin chuck 31. The rim of the wafer W can be inserted into grooves 4 and 5 that are formed on lateral sides of the etching members 2 and 3 on the side of the wafer W and extends horizontally along the surface of the wafer W. An etching solution can be supplied to internal spaces of the grooves 4 and 5 via etching solution-feeding pipes 17 and 18 and can be discharged via etching solution-discharge pipes 19 and 20. COPYRIGHT: (C)2004,JPO