| 摘要 |
PROBLEM TO BE SOLVED: To provide a leveling device that can make all solder bumps provided on a substrate of uniform and stable height. SOLUTION: This leveling device is provided with a first contacting means which comes into contact with one side face of the substrate provided with the solder bumps, a leveling means which makes the solder bumps of an uniform height, and a second contacting means which is abuttted with the other side face of the substrate. This leveling device is also provided with a driving means which relatively makes the first and second contacting means to be brought close to each other and separate from each other. This leveling device is constituted to level the heights of the solder bumps while the first and second contacting means hold the substrate between them. COPYRIGHT: (C)2004,JPO
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