METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device having a structure that has a possibility of becoming mechanically fragile such as a thin wall section can be formed without breaking the device. SOLUTION: The semiconductor device manufactured by this method has thin wall sections 21 and thick wall sections 11 and 11 provided around the thin wall sections 21, both of which are formed by engraving a semiconductor substrate 1. The semiconductor substrate 1 is divided into individual elements by etching the prescribed positions of the thick wall sections 11 and 11 from both surfaces of the substrate 1. COPYRIGHT: (C)2004,JPO