| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor having mounting lands of solder ball or inner layer joint lands of multilayer structure where the wet area of the land and solder is large, having no angular structure becoming a stress concentrating point, having no irregularities of circuit on the semiconductor element mounting face and exhibiting excellent reliability of packaging and joint by preventing troubles of microvoids, and the like, in the underfilling or resin sealing process at the time of packaging. SOLUTION: In the method for producing a substrate for mounting a semiconductor, conductor posts formed on a conductive frame are jointed to a substrate being jointed through a jointing metallic material and an adhesive layer and then lands are formed through a step for removing the conductive frame. COPYRIGHT: (C)2004,JPO
|
