| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent peeling of a flexible substrate and disconnection of internal wiring to be caused by thermal expansion of a bus substrate, especially in the case of a heat shock test in a liquid crystal display formed by connecting the bus substrate with a terminal part of a liquid crystal panel via the flexible substrate. SOLUTION: Substrate support means 20 for supporting the bus substrate 3 to the terminal part 2 are arranged on both sides of a TCP (flexible substrate) 4 that connects the terminal part 2 with the bus substrate 3, the substrate support means 20 are fixed to the bus substrate 3 via a prescribed fixing means and the terminal 2 is linked with the substrate support means 20 via resin 30 for fixation of which shearling elastic modulus at 25°C is equal to or more than 5 MPa. COPYRIGHT: (C)2004,JPO
|
