| 摘要 |
<p>Unnecessary crossing of interconnections are eliminated to reduce impedance of LSI wiring in a semiconductor integrated circuit device. The semiconductor integrated circuit device includes a circuit block having many elements such as resistances, transistors and capacitors. Pad electrically connected with the circuit blocks and protection circuits electrically connected with the pads are aligned along a periphery of the circuit block. Impedance of the wiring in the LSI is reduced by disposing a top layer metal providing a power supply voltage Vcc along outer sides of the aligned pads and protection circuits, and by disposing a bottom layer metal providing ground voltage as wide as possible over the entire space between the circuit block and the aligned pads and protection circuits.</p> |
