发明名称 |
Wafer-bonding using solder and method of making the same |
摘要 |
A method is provided for forming a wafer stack. This may include providing a first wafer having a first plurality of metalized trenches on a surface of the first wafer. A second wafer may be provided having a second plurality of metalized trenches on a surface of the second wafer facing the first wafer. The first plurality of metalized trenches may be solder bonded to the second plurality of metalized trenches. |
申请公布号 |
US6667225(B2) |
申请公布日期 |
2003.12.23 |
申请号 |
US20010015618 |
申请日期 |
2001.12.17 |
申请人 |
INTEL CORPORATION |
发明人 |
HAU-RIEGE STEFAN;HAU-RIEGE CHRISTINE |
分类号 |
H01L21/301;H01L21/98;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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