| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a porous organic silica glass film with low dielectric constant, improved chemical property, thermal stability and chemical tolerance. <P>SOLUTION: This method is provided to manufacture a porous organic silica glass film expressed with a formula, Si<SB>v</SB>O<SB>w</SB>C<SB>x</SB>H<SB>y</SB>F<SB>z</SB>(in this case, v + w + x + y + z = 100%, v is 10 to 35 atom%, w is 10 to 65 atom%, x is 5 to 30 atom%, y is 10 to 50 atom%, and z is 0 to 15 atom%). Then, gaseous reagent containing precursor and porogens chosen from a group comprising organosilane and organosiloxane is introduced to a vacuum chamber, energy is added to the gaseous reagent to produce the reaction of the gaseous reagent, and a preparative film is accumulated on a substrate. The preparative film is provided with pores, and all the porogens are substantially removed to obtain a porous film whose dielectric constant is less than 2.6. <P>COPYRIGHT: (C)2004,JPO</p> |
