发明名称 |
Process and structure for manufacturing plastic chip carrier |
摘要 |
A process for forming a burrless castellation for a plastic chip carrier comprising forming one or more through holes in a substrate, plating the through holes with a metal to a thickness ranging from about 2 microns to about 6 microns, routing slots along the line extending through the through holes to produce half cylinder-shaped side-contact surfaces, and plating the half cylinder-shaped side-contact surfaces to a thickness in the range of 15 to 25 microns.
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申请公布号 |
US6675472(B1) |
申请公布日期 |
2004.01.13 |
申请号 |
US20000548671 |
申请日期 |
2000.04.13 |
申请人 |
UNICAP ELECTRONICS INDUSTRIAL CORPORATION |
发明人 |
HUANG EDWARD;MA JONNY;CHEN SCOTT;WU PAUL |
分类号 |
C25D5/02;C25D7/12;H01L21/48;H01L23/12;H01L23/498;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):H01K3/10 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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