MANUFACTURING METHOD OF ELECTRON SOURCE

摘要

PROBLEM TO BE SOLVED: To reduce the distribution of forming potential or electric power due to voltage drop in wiring by eliminating creep voltage and current around an electron emission part forming film during forming.

SOLUTION: The forming process of the electron emission part of a surface conductive type electron emission device has an energization forming process carried out by supplying electricity to each elements through wiring. In the energization forming process, the position of an element formed in a plurality of elements connected to wiring is detected for making constant the power applied to each elements or voltage applied to all elements. The applied power or applied voltage needed for forming another elements is controlled in association with the positions.

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