发明名称 |
Substrate treatment process |
摘要 |
A substrate treatment process includes plural steps of delivering a long substrate with application of tensile force to the substrate, wherein the strength of the tensile force is changed at least between a first delivery step and a second delivery step. This process prevents enlargement of edge waviness of a belt-shaped substrate to stabilize the plasma discharge.
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申请公布号 |
US6694792(B2) |
申请公布日期 |
2004.02.24 |
申请号 |
US20010900010 |
申请日期 |
2001.07.09 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
TANAKA MASATOSHI;OHTOSHI HIROKAZU;TAKAI YASUYOSHI |
分类号 |
C23C14/56;B21D3/12;C23C16/44;H01L21/203;H01L21/205;H01L31/00;H01L31/0392;H01L31/04;H01L31/075;H01L31/18;H01L31/20;(IPC1-7):B21D3/12 |
主分类号 |
C23C14/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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