发明名称 |
SYSTEMS AND METHODS FOR PROVIDING DATA CHANNELS AT A DIE-TO-DIE INTERFACE |
摘要 |
A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different. |
申请公布号 |
WO2016060780(A9) |
申请公布日期 |
2016.12.01 |
申请号 |
WO2015US50596 |
申请日期 |
2015.09.17 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
PETERSON, LuVerne Ray;BRYAN, Thomas Clark;LOKE, Alvin Leng Sun;WEE, Tin Tin;LYNCH, Gregory Francis;KNOL, Stephen Robert |
分类号 |
G06F1/10;G06F17/50;G11C7/22;H04L7/00 |
主分类号 |
G06F1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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