发明名称 SYSTEMS AND METHODS FOR PROVIDING DATA CHANNELS AT A DIE-TO-DIE INTERFACE
摘要 A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.
申请公布号 WO2016060780(A9) 申请公布日期 2016.12.01
申请号 WO2015US50596 申请日期 2015.09.17
申请人 QUALCOMM INCORPORATED 发明人 PETERSON, LuVerne Ray;BRYAN, Thomas Clark;LOKE, Alvin Leng Sun;WEE, Tin Tin;LYNCH, Gregory Francis;KNOL, Stephen Robert
分类号 G06F1/10;G06F17/50;G11C7/22;H04L7/00 主分类号 G06F1/10
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