COPPER FOIL WITH RESIN LAYER AND MULTILAYERED PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a resin layer not generating a crack in a filled resin layer by a heat shock in a soldering process or the like when a via-hole or the like is filled using the copper foil with the resin layer.

SOLUTION: A resin composition constituting the resin layer of the copper foil with the resin layer wherein the resin layer is provided on one surface of the copper foil comprisies 20 to 70 pts.wt. of (1) an epoxy resin, 5 to 30 pts.wt. of (2) a polymer having a crosslinkable functional group in its molecule and a crosslinking agent therefor and 10 to 60 pts.wt. of (3) a compound having a structure represented by the formula.

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