Micromechanical sensor system combination and a corresponding manufacturing method

摘要

A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

主权项

1. A micromechanical sensor system combination, comprising:
an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, wherein the interposer chip has first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; and a micromechanical sensor chip system including a second front side and a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, wherein the first front side is attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts, wherein a further chip is situated within the interposer chip, wherein the further chip is embedded at least partially into the interposer chip and the interposer chip has second electrical vias which electrically connect the further chip to the second electrical contacts, wherein at least one of the second electrical vias is connected to at least one of second electrical contacts via a printed conductor, and at least one of the second electrical vias is directly connected to at least one of second electrical contacts.