发明名称 Working apparatus
摘要 A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.
申请公布号 US6722956(B2) 申请公布日期 2004.04.20
申请号 US20000748385 申请日期 2000.12.27
申请人 NIPPEI TOYAMA CORPORATION 发明人 OKUYAMA TETSUO;MURAI SHIROU;SAITA KUNIHIRO;WADA TOYOTAKA;KAWATSU TOMOYUKI
分类号 B24B7/22;B24B41/047;B24B45/00;(IPC1-7):B24B1/00 主分类号 B24B7/22
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