发明名称 |
Method for quantifying uniformity patterns and including expert knowledge for tool development and control |
摘要 |
A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.
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申请公布号 |
US6723574(B1) |
申请公布日期 |
2004.04.20 |
申请号 |
US20020328876 |
申请日期 |
2002.12.23 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BAILEY, III ANDREW D.;YADAV PUNEET;MISRA PRATIK |
分类号 |
H01L21/66;(IPC1-7):G01R31/26;G01B5/28;G01B5/30;G06F19/00 |
主分类号 |
H01L21/66 |
代理机构 |
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地址 |
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