| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of flip-chip connection by securing the sinking of an electrode of a wiring board with a light load. SOLUTION: A plurality of connection terminals 3c of a separate board 3 are each composed of a pair of electrode bodies 3d arranged on each side of a space 3e interposed between the electrode bodies 3d. The flip-chip connection is carried out by the use of the separate board 3 in the assembling operation of a semiconductor device. By this setup, when the flip-chip connection is made, a gold bump 1d is brought into contact with ends of the electrode bodies 3d to press them down, so that the electrode bodies 3d kept in a cantilevered state can be easily deformed by a light load. Therefore, the desired sinking of the connection terminal 3c can be secured with a light load, and the flip-chip connection can be improved in connection reliability. COPYRIGHT: (C)2004,JPO |
