| 摘要 |
PURPOSE: An upper ring of a CMP(Chemical Mechanical Polishing) apparatus is provided to be capable of uniformly polishing a wafer by equally contacting a polishing pad on the surface of the wafer using the weight of liquid. CONSTITUTION: An upper ring of a CMP apparatus is provided with an upper ring arm(32) capable of rotating the upper ring, a rotating shaft(110) having an air path(111), a body(120) having a mounting space(121) connected with the lower portion of the rotating shaft for rotating with the rotating shaft, a pressing plate(130) inserted into the upper portion of the mounting space of the body for connecting with the lower portion of the rotating shaft, an adsorption plate(140) having an air suction hole(141) inserted into the lower portion of the mounting space of the body, an air suction pipe(150) inserted through the pressing plate into the air path of the rotating shaft, and pressing liquid(160) stored a closed space formed by the pressing plate and adsorption plate for uniformly pressing the adsorption plate.
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