| 摘要 |
PROBLEM TO BE SOLVED: To provide a subcarrier for an optical semiconductor element wherein wiring conductor layers are formed extendedly from the top face of an insulating base to one side face to enhance reliability of electrical connection. SOLUTION: The subcarrier comprises an insulating base 1 having an approximate cuboid, a PD mounting part 14a which is formed on one side face of the insulating base 1 and composed of a conductor layer on which a photodiode (PD) 2 is mounted, a first wiring pattern 14b connected to the PD mounting part 14a and a second wiring pattern 14c electrically connected to the PD 2 both being formed from the top face to the one side face of the insulating base 1, and L-shaped metal members 15a, 15b which are separately connected to the first and the second patterns 14b, 14c so as to cover them at the corner between the top face and the side face of the insulating base 1. COPYRIGHT: (C)2004,JPO |
